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Zeitschriftenartikel:

A. Nesic, M. Blaicher, T. Hoose, A. Hofmann, M. Lauermann, Y. Kutuvantavida, M. Nöllenburg, S. Randel, W. Freude, C. Koos:
"Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses";
Optics Express, 27 (2019), 12; S. 17402 - 17425.



Kurzfassung englisch:
Complex photonic-integrated circuits (PIC) may have strongly non-planar topologies
that require waveguide crossings (WGX) when realized in single-layer integration platforms. The
number of WGX increases rapidly with the complexity of the circuit, in particular when it comes
to highly interconnected optical switch topologies. Here, we present a concept for WGX-free PIC
that relies on 3D-printed freeform waveguide overpasses (WOP).We experimentally demonstrate
the viability of our approach using the example of a 4 4 switch-and-select (SAS) circuit
realized on the silicon photonic platform. We further present a comprehensive graph-theoretical
analysis of di erent n n SAS circuit topologies. We find that for increasing port counts n of
the SAS circuit, the number of WGX increases with n4, whereas the number of WOP increases
only in proportion to n2.


"Offizielle" elektronische Version der Publikation (entsprechend ihrem Digital Object Identifier - DOI)
http://dx.doi.org/10.1364/OE.27.017402

Elektronische Version der Publikation:
https://publik.tuwien.ac.at/files/publik_280644.pdf


Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.