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Books and Book Editorships:

A. Küpper, Y. Park, P. Ruppel, S. Schulte, J. Xu (ed.):
"Proceedings of the 2019 IEEE International Conference on Decentralized Applications and Infrastructures (DAPPCON 2019)";
IEEE, 2019, ISBN: 978-1-7281-1264-0; 198 pages.


Created from the Publication Database of the Vienna University of Technology.