Vorträge und Posterpräsentationen (mit Tagungsband-Eintrag):
M. Franz, T. Kupka, G. Schmid, J. Nicolics:
"Greenhouse Gas Emissions of Printed Circuit Board Manufacturing of Different Technologies";
Vortrag: 42nd International Spring Seminar on Electronics Technology - ISSE2019,
Wroclaw, Polen;
15.05.2019
- 19.05.2019; in: "42nd International Spring Seminar on Electronics Technology",
(2019),
ISBN: 978-83-7493-070-3;
S. 151
- 152.
Kurzfassung englisch:
The fabrication of printed circuit boards (PCBs) has a significant share of the
environmental impact of the manufacturing of electronic modules. The aim of this work is to
evaluate the greenhouse gas (GHG) emissions of two functional equivalent PCBs for a miniature
camera module fabricated in different technologies by means of a comparative life cycle
assessment. One is manufactured in conventional technology and the other one in embedding
technology for miniaturization. Furthermore, the influence of the electricity mix of the
manufacturing location is investigated. The results show, that the miniaturized module package
fabrication as a whole has about 1/3 less emissions. The emissions of the PCB manufacturing
only differ to a small extent.
Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.