Talks and Poster Presentations (with Proceedings-Entry):
J. Franco, Z. Wu, G. Rzepa, A. Vandooren, H. Arimura, L. Ragnarsson, G. Hellings, S. Brus, D. Cott, V. De Heyn, G. Groeseneken, N. Horiguchi, J. Ryckaert, N. Collaert, D. Linten, T. Grasser, B. Kaczer:
"BTI Reliability Improvement Strategies in Low Thermal Budget Gate Stacks for 3D Sequential Integration";
Talk: IEEE International Electron Devices Meeting (IEDM),
San Francisco, USA;
2018-12-01
- 2018-12-05; in: "Proceedings of the IEEE International Electron Devices Meeting (IEDM)",
(2018),
ISBN: 978-1-7281-1987-8;
34.2.1
- 34.2.4.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/IEDM.2018.8614559
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2018/CP2018_Franco_3.pdf
Created from the Publication Database of the Vienna University of Technology.