Contributions to Books:

A. Herkersdorf, M. Engel, M. Glaß, J. Henkel, V. Kleeberger, J. Kühn, P. Marwedel, D. Mueller-Gritschneder, S. Nassif, S. Rehman, W. Rosenstiel, U. Schlichtmann, M. Shafique, J. Teich, N. Wehn, C. Weis:
"RAP Model-Enabling Cross-Layer Analysis and Optimization for System-on-Chip Resilience";
in: "Dependable Embedded Systems", J. Henkel, N. Dutt (ed.); Springer Nature Switzerland AG, Switzerland, 2020, ISBN: 978-3-030-52016-8, 1 - 27.

"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)

Created from the Publication Database of the Vienna University of Technology.