Contributions to Books:
A. Herkersdorf, M. Engel, M. Glaß, J. Henkel, V. Kleeberger, J. Kühn, P. Marwedel, D. Mueller-Gritschneder, S. Nassif, S. Rehman, W. Rosenstiel, U. Schlichtmann, M. Shafique, J. Teich, N. Wehn, C. Weis:
"RAP Model-Enabling Cross-Layer Analysis and Optimization for System-on-Chip Resilience";
in: "Dependable Embedded Systems",
J. Henkel, N. Dutt (ed.);
Springer Nature Switzerland AG,
Switzerland,
2020,
ISBN: 978-3-030-52016-8,
1
- 27.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1007/978-3-030-52017-5_1
Created from the Publication Database of the Vienna University of Technology.