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Vorträge und Posterpräsentationen (mit Tagungsband-Eintrag):

L. Waltersdorfer, F. Rinker, L. Kathrein, S. Biffl:
"Experiences with Technical Debt and Management Strategies in Production Systems Engineering";
Vortrag: International Conference on Technical Debt 2020 (TechDebt 2020), Seoul; Südkorea; 28.06.2020 - 30.06.2020; in: "Proceedings of the 3rd International Conference Technical Debt Conference (TechDebt)", ACM, (2020), ISBN: 978-1-4503-7960-1; S. 41 - 50.



Kurzfassung englisch:
Technical Debt (TD) has proven to be a suitable communication concept for software-intensive contexts to raise awareness regarding
longterm negative effects of deviations from standards and guidelines. TD has also been introduced to systems engineering domain,
to communicate design shortcomings in long-running, softwareassisted systems. We analysed potential TD in the engineering data
exchange for production system engineering. Similar to requirements engineering in software-intensive systems, data exchange
in the design phase plays an integral part in Software Engineering
(SE) for Production Systems Engineering: Specifications, and physical logic have to be derived from heterogeneous plant models or
parameter tables designed by different stakeholders. However, traditional procedures and inadequate tool support lead to inefficient
data extraction and integration. We identified debt arising from
knowledge representation, data model and the exchange process.
The refinement validation of identified TD was achieved through
semi-structured interviews with representatives in two analysed
companies. In an online survey with ten participants from an industrial consortium we evaluated whether the identified TD concepts
also applied to other companies, which is true for the majority of
TD. Furthermore, we discuss promising TD management strategies
to repay and manage negative effects and the accumulation of additional debt, such as improved communication, test-driven model
engineering and visualisation of engineering models


"Offizielle" elektronische Version der Publikation (entsprechend ihrem Digital Object Identifier - DOI)
http://dx.doi.org/10.1145/3387906.3388627


Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.