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G. Siroky, E. Kraker, J. Magnien, E. Kozeschnik, D. Kieslinger, W. Ecker:
"Numerical study on local effects of composition and geometry in self-healing solders";
Talk: 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Hannover; 2019-03-24 - 2019-03-27; in: "20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems", (2019), ISBN: 978-1-5386-8040-7; 21 - 37.

This paper introduces a numerical approach dealing with self-healing solder materials with more detailed discussion of the damage and healing behavior of solder joints through creep deformation. The description of damage- and subsequent healing processes was done within the continuum damage mechanics (CDM) framework, assuming the formation of voids in the material due to plastic deformation. The present model considers a potential healing effect by void closure due to viscous flow of the solder-material and capillary forces. It is assumed that partial melting of a two-phase solder material facilitates this effect. The proposed healing model introduces a concept to describe void closing effects under consideration of phase transformation by using exemplary Sn-Bi alloys.

Numerical study, self-healing solders