Talks and Poster Presentations (with Proceedings-Entry):
G. Siroky, E. Kraker, J. Magnien, E. Kozeschnik, D. Kieslinger, W. Ecker:
"Numerical study on local effects of composition and geometry in self-healing solders";
Talk: 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,
Hannover;
2019-03-24
- 2019-03-27; in: "20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems",
(2019),
ISBN: 978-1-5386-8040-7;
21
- 37.
English abstract:
This paper introduces a numerical approach dealing with self-healing solder materials with more detailed discussion of the damage and healing behavior of solder joints through creep deformation. The description of damage- and subsequent healing processes was done within the continuum damage mechanics (CDM) framework, assuming the formation of voids in the material due to plastic deformation. The present model considers a potential healing effect by void closure due to viscous flow of the solder-material and capillary forces. It is assumed that partial melting of a two-phase solder material facilitates this effect. The proposed healing model introduces a concept to describe void closing effects under consideration of phase transformation by using exemplary Sn-Bi alloys.
Keywords:
Numerical study, self-healing solders
Created from the Publication Database of the Vienna University of Technology.