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G. Siroky, D. Melinc, J. Magnien, E. Kozeschnik, D. Kieslinger, E. Kraker, W. Ecker:
"Healing solders: A numerical investigation of damage-healing experiments";
Keynote Lecture: 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Virtuell; 2020-07-05 - 2020-07-08; in: "2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)", (2020), ISBN: 978-1-7281-6049-8; 1 - 7.

The effect of liquid-assisted healing (LAH) of solder materials is investigated by means of experiments and numerical modelling. An in-situ heating experiment shows the material transport due to viscous flow into a surface cavity and, thus, motivates the development of the semi-solid viscous flow model. The mechanical healing effect is illustrated through a damage-healing experiment, where cylindrical samples are loaded under cyclic tension until fracture. A healing procedure allows for crack closure due to viscous material transport and a subsequent post-healing loading sequence shows the regain of mechanical properties. A finite element model of the experiment is used for further analysis of the damage-healing behaviour. In particular, the role of the microstructural mobility parameter is discussed based on model evaluations.

solder, healing, modelling, FEM, fracture, semi-solid

http://dx.doi.org/10.1109/EuroSimE48426.2020.9152751