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Talks and Poster Presentations (with Proceedings-Entry):

J. Stampfl:
"Fracture mechanical design of new photopolymers for Additive Manufacturing";
Keynote Lecture: 14th Polymer Meeting PM14, Graz (invited); 08-30-2021 - 09-02-2021; in: "Polymer Meeting 14", Verlag der TU Graz, (2021), ISBN: 978-3-85125-844-8; 54.



English abstract:
Lithography-based methods for additive manufacturing of polymers, ceramics and metals enable the fabrication of precise, complex-shaped parts with excellent surface quality in applications like biomedical engineering, electronics and consumer products. Photopolymers contributed 33% to the worldwide materials sales in 2020, thus making lithography-based AM (L-AM) the most widely used AM technology. Although polymers are the dominating material class for L-AM, it is also possible to manufacture composite, ceramic and metallic materials using L-AM.
The goal in the development of innovative photopolymers for AM is to achieve similar ther-momechanical properties like engineering thermoplastics, e.g. ABS or polyamide. In this work, a fracture mechanical approach is used to understand the influence of processing con-ditions and chemical structure of the utilized monomers on the finally observed mechanical properties.
Traditional photopolymers for L-AM provide high strength and stiffness, but typically lack sufficiently high fracture toughness [1] due to the high cross-link density which prevents plas-tic deformation. Several approaches are available for increasing toughness [2], e.g. the in-troduction of cross-linkers with spacers which increase the physical interaction within the final polymer chains (e.g. hydrogen bonds). Dedicated chain transfer agents [3] are also beneficial for improving ductility of the polymer without sacrificing the reactivity of the res-in.
In addition to presenting new concepts for improving thermomechanical properties of pho-topolymers, an overview of recently developed 3D-printable materials will be given, allow-ing to tackle challenges associated with innovative applications in biomedicine, electronics and engineering.


"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.3217/978-3-85125-844-8


Created from the Publication Database of the Vienna University of Technology.