Talks and Poster Presentations (with Proceedings-Entry):
L. Filipovic, X. Klemenschits:
"Fast Model for Deposition in Trenches using Geometric Advection";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Dallas, Texas (USA);
2021-09-27
- 2021-09-29; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(2021),
224
- 228.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/SISPAD54002.2021.9592595
Electronic version of the publication:
https://www.iue.tuwien.ac.at/pdf/ib_2021/CP2021_Filipovic_5.pdf
Created from the Publication Database of the Vienna University of Technology.