Beiträge in Tagungsbänden:
R. Prestros, K. Hollaus, B. Auinger, M. Leumüller:
"Benchmark for the Near-Field Problem: Simulation versus Measurement";
in: "2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE",
1;
F. Maradei, M. Feliziani, M. Sarto (Hrg.);
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE,
IEEE, Danvers, MA, USA,
2021,
ISBN: 978-1-7281-5579-1,
Paper-Nr. 20096561,
5 S.
Kurzfassung englisch:
This paper evaluates how exactly impedances and the near field around a typical housing of an electronic based system with openings can be simulated. Two variants of the device under test (DUT) representing typical electronic device housings with balanced and unbalanced feeding were built and simulated. The 3D finite element simulation results showing the electric field strength and impedance plots are compared to near-field and impedance measurements. The results should give a feeling how exactly the shielding effect on the near field of an electronic housing can be simulated.
"Offizielle" elektronische Version der Publikation (entsprechend ihrem Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/EMCEUROPE48519.2020.9245866
Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.