Talks and Poster Presentations (with Proceedings-Entry):
Z. Goekdeniz, M. Lederer, G. Khatibi, J. Nicolics:
"Temperature Dependent Relaxation Behavior of Ag-Sintered Copper Joints";
Talk: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Gothenburg, Sweden;
09-13-2021
- 09-16-2021; in: "2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)",
(2021),
1
- 5.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.23919/EMPC53418.2021.9585013
Electronic version of the publication:
https://publik.tuwien.ac.at/files/publik_302457.pdf
Created from the Publication Database of the Vienna University of Technology.