Contributions to Books:
V. Sverdlov, O. Baumgartner, T. Windbacher, S. Selberherr:
"Silicon for Spintronic Applications: Strain-Enhanced Valley Splitting";
in: "Future Trends in Microelectronics",
S. Luryi, J. Xu, A. Zaslavsky (ed.);
John Wiley & Sons,
2010, (invited),
ISBN: 978-0-470-55137-0,
281
- 291.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1002/9780470649343.ch24
Electronic version of the publication:
http://publik.tuwien.ac.at/files/PubDat_192608.pdf
Created from the Publication Database of the Vienna University of Technology.